http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015221885-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_943ce8b5eab241d0469c8cbcbcd3dbce |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J153-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00 |
| filingDate | 2014-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b88e69ead3c8229739cd1595e48da43b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a06c350c89104a65d580def5022bb4b9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dbeff632ea54fbfe9da7a51ea0189a53 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_011e0b5bc0b13fe85616ad051777816f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87abd187ba3be5ea9fe6a82d9c84a515 |
| publicationDate | 2015-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015221885-A |
| titleOfInvention | Adhesive composition, adhesive sheet, and printed wiring board plating method |
| abstract | Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive sheet, and a printed wiring board plating method that can achieve both conformability to unevenness of a circuit pattern and reduction of adhesive residue at the time of peeling, and further have high heat resistance. The present invention comprises a first acrylic block copolymer containing a methacryl block and an acrylic block, and a second acrylic block copolymer or an acrylic non-block polymer not containing a methacryl block, The pressure-sensitive adhesive composition in which the content ratio of the first acrylic block copolymer relative to the total mass of the first acrylic block copolymer, the second acrylic block copolymer, and the acrylic non-block polymer is 10% by mass or more. It is. The storage elastic modulus at 20 ° C. of the pressure-sensitive adhesive composition is preferably 5 MPa or more, the storage elastic modulus at 140 ° C. is preferably 5 MPa or less, and the ratio of the storage elastic modulus at 20 ° C. to the storage elastic modulus at 140 ° C. is 2 or more. Is preferred. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016183275-A |
| priorityDate | 2014-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 106.