http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015212426-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 |
| filingDate | 2015-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7172affc18f5090315af90b042a886ea http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dcd4ebe84b512b21b72f31825013c335 |
| publicationDate | 2015-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015212426-A |
| titleOfInvention | Surface treated copper foil, copper clad laminate, printed wiring board, electronic device, semiconductor package, printed wiring board manufacturing method, resin substrate manufacturing method, method of transferring copper foil surface profile to resin substrate, and resin base Material |
| abstract | [PROBLEMS] To eliminate the need for etching when removing a copper foil from a resin base material after bonding the resin base material to the copper foil, without impairing the profile of the copper foil surface transferred to the surface of the resin base material. A surface-treated copper foil capable of removing a copper foil at a good cost is provided. A surface-treated copper foil does not have roughened particles and has a surface roughness with Rz of 0.1 to 5.0 μm and a mold release provided on the surface of the copper foil with the surface roughness. And a release layer that makes the resin substrate peelable when the resin substrate is bonded to the copper foil from the release layer side. The release layer is constituted by using an aluminate compound represented by the following formula: a hydrolysis product thereof, or a condensate of hydrolysis products, alone or in combination. [Selection] Figure 1 |
| priorityDate | 2015-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 401.