abstract |
Provided is a resin composition that can be applied with a film thickness of 1 μm or more after curing using a thermosetting technique, and that exhibits high transparency, high solvent resistance, and excellent liquid crystal alignment ability. A resin composition comprising a compound (B component) having a cyclohexene ring at the terminal represented by formula (1) and a binder polymer (D component). [R is a C1-20 organic group; X is a hydrogen atom, a methyl group or a halogen atom] |