http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015207012-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F12-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2015-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fee400e09af20d57fe0613da970fc514 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d664a2a31377ce69eb486c99d12a8ba4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_791dac8ea442c9e7921dcd0d52091eb4 |
| publicationDate | 2015-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015207012-A |
| titleOfInvention | Manufacturing method of resin structure for microstructure and manufacturing method of microstructure |
| abstract | [MEANS FOR SOLVING PROBLEMS] (A) (1) A polymer compound in which a part of a phenolic hydroxyl group is protected by a protecting group capable of acid elimination, (2) a photoacid generator, (3) an epoxy compound, (4) Using the composition for forming a photopatternable film containing an organic solvent, applying to the substrate as a photopatternable sacrificial film, (B) heating the substrate, (C) first high energy in the sacrificial film (D) a step of forming a sacrificial film pattern by development, (E) a sacrificial film pattern having a wavelength of only 254 nm as a second high energy line in the obtained sacrificial film pattern. Including a step of irradiating ultraviolet rays or broadband ultraviolet rays including 254 nm, (F) a step of heating the substrate, (C) an irradiation amount of the first high energy ray is 250 mJ / cm 2 or less, and (F) the substrate after My side wall angle with the sacrificial film is 80? Method for producing a B structure resin structure. [Effect] Provision of sacrificial layer pattern with high heat resistance. [Selection figure] None |
| priorityDate | 2015-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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