http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015203080-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-00
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
filingDate 2014-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3a0a5679d738db18300d5ea4bd9f950
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd836f00fdf0fa376bc6038ada80053c
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publicationDate 2015-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2015203080-A
titleOfInvention Polishing composition
abstract When polishing is performed on a substrate that includes an alloy material and a resin on the surface and the ratio of the area of the alloy material to the entire polishing area is within a specific range, the polishing rate of the alloy material and the polishing rate of the resin Polishing can reduce the difference between the alloy material and the resin, and can polish both the alloy material and the resin at a high polishing rate, and can obtain a substrate having a highly glossy surface with excellent smoothness of the substrate surface after polishing. A composition is provided. A polishing composition for use in polishing a substrate comprising an alloy material and a resin on a surface and having a ratio of the area of the alloy material to the entire polishing area of 60 to 95%, the volume A polishing composition comprising crystalline abrasive grains having an integrated 50% particle diameter (D 50 ) of 5.0 μm or more based on a standard particle size distribution, an acid or a salt thereof, and a water-soluble polymer. [Selection figure] None
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priorityDate 2014-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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