http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015198106-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2014-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e94f81c2e2eed900c05940eacd1fb3e6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_035f220ade7116032621666e6afcdaf3 |
| publicationDate | 2015-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015198106-A |
| titleOfInvention | Metal-based circuit board and electronic device |
| abstract | The present invention provides an electronic device having high heat dissipation, effectively preventing warpage due to temperature change, and having excellent connection reliability of electronic components, and also having high heat dissipation due to temperature change. Provided is a metal base circuit board that can be suitably applied to an electronic device that is effectively prevented from warping and has excellent connection reliability of electronic components. A metal base circuit board includes a metal substrate, an insulating film provided on the metal substrate, and a metal film provided on the insulating film. The metal substrate 1 is provided with a groove 11 on the surface facing the insulating film 2. Moreover, it is preferable that both ends of the groove 11 are open to the side surface of the metal substrate 1. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106879169-A |
| priorityDate | 2014-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 71.