http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015198104-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05
filingDate 2014-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e94f81c2e2eed900c05940eacd1fb3e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_035f220ade7116032621666e6afcdaf3
publicationDate 2015-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2015198104-A
titleOfInvention Metal-based circuit board and electronic device
abstract [PROBLEMS] To provide an electronic device having high heat dissipation, effectively preventing warpage due to temperature change, and having excellent connection reliability of electronic components, and also having high heat dissipation, temperature change. Providing a metal base circuit board that can be suitably applied to an electronic device that is effectively prevented from being warped and has excellent connection reliability of electronic components. A metal base circuit board includes a metal substrate, an insulating film provided on the metal substrate, and a metal film provided on the insulating film. The substrate has a surface opposite to the surface corresponding to the insulating film, one end opened to a side surface of the metal substrate, and the other end opened to a side surface of the metal substrate. Has no groove 11. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108712965-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017150586-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017150586-A1
priorityDate 2014-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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