| abstract |
An object of the present invention is to provide a semiconductor package that reduces heat transfer from a lower chip to an upper chip in a stacked semiconductor package. A stacked semiconductor package according to an embodiment of the present invention includes a first circuit board, a first semiconductor package in which a first semiconductor element is mounted on the first circuit board, and a second semiconductor package. A circuit board; a second semiconductor package in which a second semiconductor element is mounted on the second circuit board and stacked on the first semiconductor package; a sealing resin for sealing the first semiconductor; A conductive layer disposed in contact with the resin; and a thermal via disposed in contact with the conductive layer and disposed on the first circuit board. [Selection] Figure 1 |