| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c8d4dc7bd1a30d8fda907fceaeb4e69 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 |
| filingDate |
2014-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83e119bcb3d4e1be957c6f7438bc1bb4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ec2803beaa40412e6d5ee1caf8cfe34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7dfb9fbeca53dedddb36a43673ad428c |
| publicationDate |
2015-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2015189935-A |
| titleOfInvention |
Thermosetting resin composition and molded body thereof |
| abstract |
To provide a highly reliable thermosetting resin composition that can be suitably used as a sealing material for a semiconductor device, and that does not cause warping or cracking even in a power device. A thermosetting resin composition comprising a thermosetting resin and a curing catalyst, and the cured product of the thermosetting resin composition has an average linear expansion coefficient (A1) of 70 to 100 ° C. and 210 to 210 ° C. A thermosetting resin composition having a ratio A2 / A1 of 0.5 to 2.0 with respect to an average linear expansion coefficient (A2) at 240 ° C. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10262914-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6168259-B1 |
| priorityDate |
2014-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |