http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015187209-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c8d4dc7bd1a30d8fda907fceaeb4e69 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-70 |
filingDate | 2014-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ec2803beaa40412e6d5ee1caf8cfe34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7dfb9fbeca53dedddb36a43673ad428c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83e119bcb3d4e1be957c6f7438bc1bb4 |
publicationDate | 2015-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2015187209-A |
titleOfInvention | Thermosetting resin composition |
abstract | An object of the present invention is to provide a thermosetting resin composition having improved heat resistance, particularly an epoxy curable resin composition, which is particularly suitable for power device applications. A thermosetting resin composition containing an epoxy siloxane compound, a gallium compound, a silanol source compound and a glycidyl ester type epoxy compound, or containing an epoxy siloxane compound, a gallium compound, a silanol source compound and an alicyclic epoxy compound. It is characterized by being. By adding these components, a cured product obtained by curing the composition does not cause poor appearance such as wrinkles or cracks, and has higher heat resistance. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015189825-A |
priorityDate | 2014-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 277.