http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015185512-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6572309f22e2ad56c1390a78ac237bed |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F3-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-18 |
| filingDate | 2014-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e2940732314777f32abe80ac65096ef http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_225827f4315533c9c1b81ceeaf2cbc74 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adcfd49ca90d5e10479bf0af537c3a38 |
| publicationDate | 2015-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015185512-A |
| titleOfInvention | Conductive pattern forming substrate and manufacturing method thereof |
| abstract | The present invention provides a method for manufacturing a conductive pattern forming substrate, which can easily manufacture a conductive pattern forming substrate in which the conductive pattern is hardly visible. A method for producing a conductive pattern forming substrate according to the present invention is formed on one surface of a transparent conductive layer 13 and a transparent conductive layer 13 containing a conductive ultrafine fiber having a diameter of 0.3 to 150 nm and a transparent resin. This is a method for producing a conductive pattern forming substrate having a conductive pattern formed on at least one surface of an insulating substrate using a transfer sheet 17 provided with the supporting resin layer 12b. A conductive pattern forming step of forming the conductive pattern by etching the conductive layer 13 by laser beam pattern irradiation, and a conductive pattern is formed on the transparent conductive layer 13 on at least one surface of the insulating substrate after the conductive pattern forming step. And an adhesion process for adhering the transferred transfer sheet 17. [Selection] Figure 3 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022210585-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109976591-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109976591-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022210586-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10187980-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016190392-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020053004-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114710891-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016157930-A1 |
| priorityDate | 2014-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 100.