| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0e7f7286c46e676b1bc0daf37b9f6c63 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C67-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2014-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c2bec76481c02c6132ed0e43f970eb9 |
| publicationDate |
2015-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2015176944-A |
| titleOfInvention |
Resin component having a three-dimensional circuit formed on its surface and method of manufacturing the same |
| abstract |
A resin component having a three-dimensional circuit formed on its surface is reduced in size and weight. A resin part having a three-dimensional circuit formed on a surface, a first part including a first thermoplastic resin and metal fine particles, and a second part including a second thermoplastic resin; And a plating film formed on the surface of the first part, and the plating film forms the three-dimensional circuit. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7010362-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022161760-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019171923-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3479998-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019171923-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7207505-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018043525-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022016532-A |
| priorityDate |
2014-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |