| abstract |
Photosensitive resin capable of forming a pattern film having a high residual film ratio, no development residue, excellent heat resistance during high-temperature baking, and excellent low dielectric properties in a pattern film forming process A composition is provided. Cyclododecatriene copolymer component, quinonediazide, containing a structural unit derived from cyclododecatriene, and a structural unit derived from ring opening of an acid anhydride monomer and then esterification with alcohol A photosensitive resin composition comprising a photosensitive agent component having a group and a compound component having an epoxy group. [Selection figure] None |