| abstract |
The present invention provides a thermosetting resin composition that can be cured at 180 ° C. or lower and can form a cured film having excellent transparency, heat resistance, solvent resistance, flatness, and dry etching properties. A resin composition comprising a component (A), a component (B) and a solvent. Component (A): Copolymer (B) having structural units represented by the following formula (1), formula (2) and formula (3) Component: 1,8-diazabicyclo [5.4.0] undecene Curing acceleration comprising one or more selected from the group consisting of 7 organic acid salts, 1,5-diazabicyclo [4.3.0] nonene-5 organic acid salts and quaternary ammonium organic acid salts catalyst [Selection] Figure 1 |