| abstract |
A composition comprising metal particles and an organic vehicle comprising at least one phenolic resin and a solvent, suitable for lead-free solder, and a method for soldering. The metal particles are preferably metal particles comprising silver, comprising at least one type of silver powder and at least one type of silver flakes, and an organic vehicle comprising at least one phenolic resin and a solvent. A conductive polymer thick film composition suitable for lead-free soldering. Applying a conductive polymer thick film composition to the surface of the substrate and curing the composition to form a cured film; and soldering to the exposed surface of the cured film using lead-free solder. Including methods. [Selection] Figure 1 |