http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015166431-A

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filingDate 2014-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cb8b7eb8cc4e438713641a36711b775
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publicationDate 2015-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2015166431-A
titleOfInvention Thermosetting resin composition, prepreg and laminate
abstract PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in balance such as high heat resistance, low dielectric constant, low dielectric loss tangent and flame retardancy, and a prepreg and a laminate for a printed wiring board using the same. (A) A compound having a dihydroxybenzoxazine ring, (B) a phenol resin, (C) an epoxy resin, (D) an aromatic vinyl compound and maleic anhydride as components, represented by the following general formula (1) The thermosetting resin composition which contains copolymer resin represented and whose copolymer resin (D) is 9.5-15 mass parts with respect to 100 mass parts of organic resin solid content total amount. (In the general formula (1), R 1 is a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms, and each R 2 is independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or (It is an aromatic hydrocarbon group, x is an integer of 0 to 3, m and n are natural numbers, and the ratio of m to n is m: n = 7: 1 to 9: 1.) [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017149859-A
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type http://data.epo.org/linked-data/def/patent/Publication

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