| abstract |
A thin film having a uniform film thickness, good step coverage, and a smooth surface is provided. A volatile metal amidinate compound is used as a precursor, and one or more of the metal amidinate compounds, then a reducing gas, a gas containing nitrogen, an oxygen-containing gas, or a vapor are applied to a heating substrate including pores or trenches. It is performed by atomic layer deposition which forms a metal thin film, a metal oxide thin film or a metal nitride thin film on the surface of the substrate by alternately exposing to the reaction gas. [Selection] Figure 1 |