http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015164197-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2015-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_644d8de44a4886fe996c13bc64e4130a |
| publicationDate | 2015-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015164197-A |
| titleOfInvention | Backgrind-underfill integrated tape and semiconductor chip mounting method |
| abstract | The present invention provides a back grind-underfill integrated tape capable of performing electrode bonding excellent in connectivity and reliability after bonding. In addition, a semiconductor chip mounting method using the back grind-underfill integrated tape is provided. A thermosetting resin layer, a bump protection layer, and a base material layer are provided in this order. The average height of bumps of a semiconductor chip to be sealed is Bh, and the thermosetting resin layer A back grind-underfill integrated tape that satisfies the following formula (1), where Uh is the thickness and Ph is the thickness of the bump protective layer. 1.09 × Bh ≦ Uh + Ph <1.5 × Bh (1) [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I711537-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017061364-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017061364-A1 |
| priorityDate | 2015-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 69.