| abstract |
Deterioration of high frequency characteristics when a high frequency signal is transmitted between a waveguide and a semiconductor chip is suppressed. A high-frequency module is disposed between a metal housing having a waveguide, a back short located on an extension of the waveguide, a semiconductor chip, and the waveguide and the back short. And a package portion 6 in which a back short circuit and a semiconductor chip are integrated with a resin 7, and the antenna coupler and the semiconductor chip are electrically connected by a rewiring line 8. Shall. [Selection] Figure 1 |