abstract |
The reliability of a semiconductor device is improved. A method of manufacturing a semiconductor device includes a step of connecting a ball portion BWb formed at a tip of a wire BW to a pad (electrode pad) PD of a semiconductor chip CHP. Further, the pad PD is made of a material whose main component is aluminum, and a groove TR1 is formed in a portion connecting the ball portion BWb. The ball portion BWb is made of a material harder than gold. Further, the step of connecting the ball part BWb includes a step of applying an ultrasonic wave to the ball part BWb. [Selection] Figure 10 |