http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015149346-A

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filingDate 2014-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2015-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2015149346-A
titleOfInvention Semiconductor device manufacturing method and semiconductor device
abstract A semiconductor device manufacturing method and a semiconductor device in which a defect level does not decrease even at a high temperature are provided. A first epitaxial growth film layer is formed on a surface of a silicon substrate, and a second epitaxial growth film layer serving as a region where the density of a specific metal element is high and the recombination lifetime of carriers is shortened on the surface. 3 are stacked. When a metal element is epitaxially grown, a material gas containing an organic metal gas containing a predetermined metal element is thermally decomposed on the surface of the silicon substrate 1 so that the metal element is taken into the epitaxially grown film. become. The metal element is replaced with silicon atoms by heat in the epitaxially grown film, and a carrier recombination level unique to the metal element is formed in the second epitaxial growth film layer 3. [Selection] Figure 2
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