http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015133526-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2015-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3af280f816f19d47c9a20fcf7ca04a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2e1943bda94327a7dee15269f7ab40c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b048780ce953657b76370c8430c2a37 |
| publicationDate | 2015-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015133526-A |
| titleOfInvention | Fiber-containing resin substrate, post-sealing semiconductor element mounting substrate, and semiconductor device manufacturing method |
| abstract | PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device and to have high versatility and to suppress warping of a substrate and separation of a semiconductor element from the substrate even when a large-diameter substrate is sealed. Another object of the present invention is to provide a fiber-containing resin substrate that can collectively seal the semiconductor element mounting surface and is excellent in heat resistance and moisture resistance after sealing. A fiber-containing resin substrate for collectively sealing a semiconductor element mounting surface of a substrate on which a semiconductor element is mounted, the fiber base material being impregnated with a thermosetting resin composition, and the thermosetting resin Uncured comprising a resin-impregnated fiber base material obtained by semi-curing or curing the composition, and an uncured thermosetting resin composition formed on one side of the resin-impregnated fiber base material with a thickness of more than 200 μm and not more than 2000 μm And at least one of a thermosetting resin composition impregnating the fiber base material and a thermosetting resin composition forming the uncured resin layer contains an ion trap agent. A fiber-containing resin substrate. [Selection] Figure 1 |
| priorityDate | 2015-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 67.