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filingDate 2014-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2015-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2015130430-A
titleOfInvention Power module substrate with heat sink and manufacturing method thereof
abstract Provided are a power module substrate with a heat sink and a method for manufacturing the same, which can reduce warpage that occurs during the manufacture of a power module substrate with a heat sink and suppress the occurrence of warpage in a heat treatment process. A power module substrate with a heat sink includes a heat sink made of a material having a linear expansion coefficient of 7 × 10 −6 / K or more and 12 × 10 −6 / K or less, and the maximum length of the heat sink 30 is set to L. When the warpage amount of the heat sink 30 is Z and the convex deformation on the joint surface 30a side of the heat sink 30 is a positive warpage amount, the ratio Z / L of L to Z is -0.002 or more and 0.002 The ratio Z / L when heated to 280 ° C. is within the range of −0.002 to 0.002 and the ratio Z / L when cooled to 25 ° C. after the heating is −0. It is within the range of 0.002 or more and 0.002 or less. [Selection] Figure 1
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