Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
filingDate |
2014-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3137a53930ad916a0470fbfc07ea4509 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45f3e75392730f01a4d41db42f018fa2 |
publicationDate |
2015-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2015130420-A |
titleOfInvention |
Conductive film adhesive, method for manufacturing semiconductor device, and semiconductor device |
abstract |
The present invention provides a film adhesive capable of suppressing the occurrence of problems in a wire bonding process. A conductive film adhesive is added after a step of die-bonding a semiconductor chip on an adherend and a step of die-bonding the semiconductor chip on an adherend via a conductive film-like adhesive. The conductive film adhesive for using for the manufacturing method of a semiconductor device including the process of thermosetting by heating at 1 to 24 degreeC for 1 to 24 hours. [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018147163-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017038920-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018133562-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016164293-A |
priorityDate |
2014-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |