http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015128175-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1935055f752dfbcb5e576f2bc6230d60 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
filingDate | 2015-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_751c4d7aabc72990e4a0b929fb4bce7a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_084935a810366c1f0e4e4a08982d455c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_974a1af905ec514c15a3b0077ca2e2ba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9bbb572ba40cd0dd616bb8eed6e73a4c |
publicationDate | 2015-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2015128175-A |
titleOfInvention | Method for treating copper surfaces to enhance adhesion to organic substrates for use in printed wiring boards |
abstract | A printed wiring board (PCB) or printed wiring board (PWB) is provided that treats a smooth copper surface, thereby enhancing the adhesion between the copper surface and an organic substrate. The copper oxide layer comprises a plurality of particles having a size of about 250 nm or less, the particles are substantially randomly oriented, and the copper oxide layer has a size of about 0.14 μmRa or less. It has a surface with roughness. The printed wiring board includes at least one copper layer, at least one polymer material layer, and a stabilization layer between the copper layer and the polymer material layer, and the stabilization layer has a thickness of about 250 nm. A plurality of particles having the following sizes are provided, and the particles are substantially irregularly oriented. [Selection] Figure 1A |
priorityDate | 2015-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 149.