| abstract |
An object of the present invention is to provide a cored solder bump and a method of manufacturing the same, which are less prone to flattening due to the weight of the bump and enable fine pitch with excellent adhesion and conductivity. In producing solder bumps, a core paste is preliminarily printed on the central portion of the bumps, and the core paste is sintered at a temperature near or below the solder metal reflow temperature. By forming a core, and then applying solder metal around the sintered core by a printing method and reflowing the solder metal, a sintered core extending in the vertical direction is formed inside the solder bump. Get a cored solder bump. [Selection] Figure 3 |