| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18161
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-19 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-96 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2013-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d558f51235128c0066525fc05b80de3d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_096e79fe344855559ec13ac6997d4bbe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12bc5b00c78815f2dd10b721001423d3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c542f37dd7b0d7bfe0c7fdac3e68833b |
| publicationDate |
2015-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2015126131-A |
| titleOfInvention |
Manufacturing method of electronic component package |
| abstract |
PROBLEM TO BE SOLVED: To provide an electronic component package manufacturing method capable of manufacturing an electronic component package with high yield by preventing chipping of a corner of a sealing resin sheet after resin sealing the electronic component. The present invention provides a process A for preparing an adherend on which one or a plurality of electronic components are arranged, and compression molding the sealing resin sheet on the adherend so as to embed the electronic component. Chamfering planned angle located on the outer periphery of the second main surface opposite to the first main surface on the adherend side of the sealing resin sheet in the hollow portion of the mold for compression molding, including the step B of laminating The portion corresponding to the portion has a shape such that the chamfered corner portion of the sealing resin sheet is chamfered by contact with the mold, and the chamfered corner portion of the sealing resin sheet that has undergone the step B Is a method of manufacturing an electronic component package that is chamfered over at least a part of the outer periphery of the second main surface. [Selection] Figure 1C |
| priorityDate |
2013-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |