http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015126031-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| filingDate | 2013-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_255185ef6b4c5c5301c8cc58c1dbd8cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a03d15d60fdee7d2ab1dac5b18d57489 |
| publicationDate | 2015-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015126031-A |
| titleOfInvention | Wiring board manufacturing method |
| abstract | A method of manufacturing a wiring board that forms a filled via having high conductivity, heat dissipation, and connection reliability by a heat treatment process at a low temperature so as not to deteriorate an insulating layer while using a conductive paste. A wiring board includes at least a first conductor layer and a second conductor layer, and each of the first conductor layer and the second conductor layer includes an insulating layer. The method of manufacturing the wiring board includes a step S1 for forming the through hole 5, a paste step S2 for filling the through hole 5 with the paste 6, a drying step S3 for heating the wiring board 1 and drying the paste 6, and a through hole. 5 includes an impregnation step S4 in which the organometallic complex solution 7 is infiltrated, and a heating step S5 in which the wiring substrate 1 is heated to reduce the organometallic complex solution 7 to form the filled via 8. A filled via 8 having high conductivity, heat dissipation, and connection reliability is formed by a method of manufacturing a wiring board. [Selection] Figure 1 |
| priorityDate | 2013-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.