| abstract |
Disclosed is a copper nanoparticle dispersion excellent in oxidation resistance, dispersibility, coating suitability, and sintering property at a low temperature or in a short time for forming a circuit pattern by screen printing or ink jet printing. The copper nanoparticles are coated with a copolymer of an alkylamine, an unsaturated carboxylic acid, and an ethylenically unsaturated monomer having an average molecular weight of 1,000 to 50,000, and the copper nanoparticles are dispersed in a solvent. , Copper nanoparticle dispersion. A method for producing a conductive substrate by applying and baking a dispersion. Even in low-temperature and short-time baking, organic components are easily decomposed and removed from the film, and a film having high conductivity can be formed. [Selection figure] None |