http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015122482-A

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filingDate 2014-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91a7a559b291767d109048499424946e
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publicationDate 2015-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2015122482-A
titleOfInvention Group III nitride semiconductor device and manufacturing method thereof
abstract PROBLEM TO BE SOLVED: To provide a group III nitride semiconductor device having a group III nitride semiconductor layer having a high In concentration and suitable for mass production, and a manufacturing method thereof. A HEMT 100 includes a substrate 110, a buffer layer 120, a channel layer 130, a barrier layer 140, a gate electrode G1, a source electrode S1, and a drain electrode D1. The channel layer 130 is disposed at a position between the substrate 110 and the barrier layer 140. A gate electrode G1, a source electrode S1, and a drain electrode D1 are disposed at a position opposite to the channel layer 130 when viewed from the barrier layer 140. The channel layer 130 is an AlYInXGa (1-X-Y) N layer. The In concentration X of the channel layer 130 is 0.3≰X≰1.0, and the Al concentration Y of the channel layer 130 is 0≰Y≰0.05. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017045856-A
priorityDate 2013-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 38.