| abstract |
[PROBLEMS] To provide a photocurable / thermosetting resin composition capable of obtaining a cured film excellent in both flexibility and thermal shock resistance without impairing properties such as solder heat resistance, heat deterioration resistance, and acid resistance, and the like. A printed wiring board having a solder resist film (cured film) formed thereon is provided. An alkali developing type photo-curing property containing a glycoluril compound represented by chemical formula (I), a photosensitive prepolymer having two or more unsaturated double bonds in one molecule, and a photopolymerization initiator. Thermosetting resin composition. (R 3 to 5 are the same or different and each represents a hydrogen atom or a glycidyl group.) [Selection figure] None |