| abstract |
The present invention provides a photosensitive resin composition, a dry film, a cured product, and a printed wiring board that are excellent in photocurability by solving the problem of solubility of a photopolymerizable initiator. A photosensitive resin composition comprising (A) a carboxyl group-containing resin, (B) a thermosetting component, (C) an inorganic filler, and (D) a photopolymerization initiator, The photopolymerization initiator is a photosensitive resin composition containing (D1) a bisacylphosphine oxide photopolymerization initiator and (D2) a hydroxyacetophenone photopolymerization initiator. [Selection figure] None |