http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015103577-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate | 2013-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45f3e75392730f01a4d41db42f018fa2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6fd396982571291ceb4307e5518a538 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3137a53930ad916a0470fbfc07ea4509 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b60a7bbd8a53df9b805291155fe4437 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1589785b3fb3faac5995e646223c34f0 |
| publicationDate | 2015-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015103577-A |
| titleOfInvention | Thermosetting die bond film, die bond film with dicing sheet, and method for manufacturing semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide a thermosetting die-bonding film capable of highly filling heat conductive particles and obtaining good unevenness followability and moisture reflow resistance, a die-bonding film with a dicing sheet using the thermosetting die-bonding film, and a semiconductor device A manufacturing method is provided. The present invention includes thermally conductive particles, and in the particle size distribution of the thermally conductive particles, a peak A exists in a particle size range of less than 2 μm, and a peak B exists in a particle size range of 2 μm or more. The present invention relates to a thermosetting die-bonding film in which the ratio of the particle size of the peak B to the particle size of the peak A is 5 to 20, and the thermal conductivity after thermosetting is 1 W / m · K or more. [Selection] Figure 1 |
| priorityDate | 2013-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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