| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-157 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2013-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_961529f2767ab17d148c2a516b5ea5bf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d558f51235128c0066525fc05b80de3d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c542f37dd7b0d7bfe0c7fdac3e68833b |
| publicationDate |
2015-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2015097231-A |
| titleOfInvention |
Manufacturing method of electronic component package |
| abstract |
PROBLEM TO BE SOLVED: To provide an electronic component package manufacturing method capable of increasing the accuracy of alignment between a sealing resin sheet and an adherend. The present invention provides a process A for preparing an adherend having a polygonal plan view on which one or a plurality of electronic components are mounted, and the shape of the plan view is substantially the same polygon as the adherend. Step B for preparing a sealing resin sheet, in plan view, at least two vertices on the polygon of the adherend, and on the polygon of the sealing resin sheet corresponding to the at least two vertices Step C for recognizing xy coordinates of at least two vertices, and the deposition so that the xy coordinates of the recognized vertices corresponding to each other in the adherend and the sealing resin sheet are closest to each other in plan view. It is a manufacturing method of the electronic component package including the process D which aligns the superimposition position of a body and the said sealing resin sheet. [Selection] Figure 4 |
| priorityDate |
2013-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |