http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015091969-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
filingDate 2014-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c783dde2aba2e81891cc7b72044cddc1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1767f524bb1fb4b69f5de6e3badced8f
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publicationDate 2015-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2015091969-A
titleOfInvention Resin composition, prepreg, resin layer, circuit board, and semiconductor device
abstract A resin composition capable of forming a cured resin having excellent adhesion to a base material when impregnated into the base material, a highly reliable prepreg, a resin layer produced using the resin composition, and a resin layer To provide a circuit board and a highly reliable semiconductor device including the circuit board. A resin composition of the present invention is used for forming a sheet-like prepreg by impregnating a base material, and contains a cyanate resin and an epoxy resin. And when this resin composition acquired the scattering profile by the small angle X-ray scattering using synchrotron radiation about the hardened | cured material, the magnitude | size of the scattering vector q is 0.02-1 [nm. -1] has at least one singularity structure. Moreover, it is preferable that at least one of a phenol resin and a hardening accelerator is included. [Selection] Figure 1
priorityDate 2014-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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