http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015088564-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| filingDate | 2013-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_513f8d4056120f2b5f0ae01bf105f3f6 |
| publicationDate | 2015-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015088564-A |
| titleOfInvention | Wiring structure manufacturing method and wiring structure |
| abstract | A highly reliable wiring structure in which a diffusion prevention film is formed so as to surely cover the boundary between an adhesion layer and a Cu wiring by a relatively simple method, and diffusion of Cu into an interlayer insulating film is surely prevented. Get. When manufacturing a wiring structure including an insulating film, a wiring having a maximum content of Cu, and an adhesive layer formed between the insulating film and the wiring, the adhesive layer is manufactured. The exposed portion from the insulating film 11 of 17 is oxidized (oxygen plasma treatment, ultraviolet light treatment, ozone treatment), and the exposed portion of the oxidized adhesion layer 17 from the insulating film 11 and the insulating film 11 of the wiring 16A are exposed. A diffusion prevention film 17 is formed to cover the exposed part. [Selection] Figure 3 |
| priorityDate | 2013-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.