| abstract |
An object of the present invention is to improve both the electrical and mechanical properties of an insulation cured product and to suppress the viscosity of a resin composition. SOLUTION: An epoxy resin, a curing agent, and fine particles are included, and when these are mixed and cured, the fine particles encapsulated in a polymer formed by a ring-opening reaction between the epoxy resin and the curing agent are obtained. A plurality of linear aggregates are formed, and the aggregates have a dendritic structure, and the base material of the fine particles is formed of silicon dioxide, aluminum oxide, titanium oxide, or boron nitride, An insulating material is an electrically insulating resin composition in which a hydrophilic group and a hydrophobic group coexist on the surface of the substrate. [Selection] Figure 1 |