| abstract |
PROBLEM TO BE SOLVED: To provide a process for forming a conductive pattern on a novel substrate. A) (a) 6 to 80% water, (b) 10 to 75%, metal particles or conductive particulate matter having a longest dimension of 100 nm to 50 micrometers, (c) 2 To 50% water-soluble styrene / (meth) acrylic copolymer, (d) 0.01 to 6% anionic surfactant, and (e) 0.1 to 4% antifoaming agent, A water-based conductive composition is applied, B) the composition is dried, and C) the composition has a sheet resistance of 200 milliohms / square or less when dried, and a film of 5 microns or less on a cellulosic substrate. A process of forming a conductive pattern on a substrate, wherein the layer having a thickness has a ratio of the surface roughness of the layer to the surface roughness of the substrate of 1.5 or less. |