http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015071728-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 |
| filingDate | 2013-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_056c75c4e3a8f970ee3e6f7fe2a3b1e2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4add575a53e8074e607918da6c32735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cfcb635aafb63f7799d6e8553ad31eb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddb15b3ad3fdd66baacf53abd953d76c |
| publicationDate | 2015-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015071728-A |
| titleOfInvention | Adhesive for semiconductor |
| abstract | Adhesion for a semiconductor capable of following an unevenness of a substrate or semiconductor chip having a complicated shape with many irregularities and suppressing voids caused by volatilization of an epoxy compound contained in the adhesive Provide the agent. The low-viscosity epoxy compound contains a low-viscosity epoxy compound, a highly reactive epoxy compound, a curing agent, a curing accelerator, and an inorganic filler. The low-viscosity epoxy compound has a viscosity of 400 mPa · s when measured at 25 ° C. and 5 rpm. The highly reactive epoxy compound is an epoxy compound having a curing rate at 210 ° C. of 3 seconds or less, and the weight ratio of the low viscosity epoxy compound to the highly reactive epoxy compound is 10 : 90 to 50:50, and the inorganic filler is the sum of the low-viscosity epoxy compound, the highly reactive epoxy compound, the curing agent, the curing accelerator, and the inorganic filler contained in the semiconductor adhesive. A semiconductor adhesive containing 50 to 75 parts by weight with respect to 100 parts by weight. [Selection figure] None |
| priorityDate | 2013-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.