| abstract |
An underfill material that realizes voidless mounting and good solderability, and a method of manufacturing a semiconductor device using the underfill material are provided. The time to reach 20% of the reaction rate at 240 ° C. calculated by the Ozawa method using a differential scanning calorimeter containing an epoxy resin and a curing agent is 2.0 sec or less, An underfill material in which the time to reach 60% of the reaction rate is 3.0 sec or more is used. As a result, voidless mounting and good solderability can be realized. [Selection] Figure 1 |