| abstract |
A solder composition having excellent solder wettability is provided. The solder composition of the present invention comprises (A) 70% by mass to 92% by mass of lead-free solder powder having a melting point of 240 ° C. or less, (B) a thermosetting resin, (C) an activator, and (D) A thermosetting resin composition containing 8% by mass or more and 30% by mass or less containing a curing agent, and the (C) activator is (C1) a dicarboxylic acid having 4 to 7 carbon atoms and (C2 ) An organic acid amine salt which is a salt of an amine and an organic acid is contained. [Selection figure] None |