| abstract |
Power module substrate and power module capable of improving heat radiation and heat resistance of power module and improving reliability by laminating metal substrate, insulating layer and conductive metal wiring layer in close contact with each other Provided are a substrate with metal wiring, a power module, and a method for manufacturing a power wiring substrate for power module. A power module metal wiring substrate in which at least a metal substrate, an insulating layer, and a conductive metal wiring layer are sequentially laminated, the insulating layer having two or more layers, a non-thermoplastic insulating layer resin layer, and a heat Power is characterized in that it consists of a plastic insulating resin layer and contains a filler so that it has good adhesion to metal substrates and conductive metal wiring layers, has heat dissipation and heat resistance, and has improved reliability. The present invention is characterized by a method for manufacturing a substrate with metal wiring for modules, a power module, a substrate for power modules, and a substrate with metal wiring for power modules. [Selection] Figure 1 |