http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015041692-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate | 2013-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd4f189cfac304c3273283d0a8ba8c14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cdcf669408d90b3e87d343b3ff8fb80 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dae2e45c4515f2b64d0a89bee10bd4d9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe934787693394abbd8a6d7834946568 |
| publicationDate | 2015-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015041692-A |
| titleOfInvention | Wiring board and manufacturing method thereof |
| abstract | A wiring board that can be thinned and has excellent flexibility and a method for manufacturing the wiring board are provided. A wiring board (1) of the present invention has a first main surface (22), a second main surface (24), and a side surface (24), and a metal layer (20) formed in a pattern. And a first insulating layer (30) disposed around the metal layer (20), and a second insulation covering the first main surface (22) of the metal layer (20). A layer (30) and a third insulating layer (50) covering the second major surface (24) of the metal layer (20) are included. [Selection] Figure 2 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7348046-B2 |
| priorityDate | 2013-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 72.