| abstract |
Provided is a moisture curable curable composition that does not require a metal compound such as an organic tin compound as a curing catalyst, and has good rapid curing, storage stability, surface curing, adhesion, and adhesive strength. An organic polymer containing 0.8 or more crosslinkable silicon groups on average in one molecule (excluding those having a Si-F bond), (B) having a Si-F bond A silicon compound and (C) a reaction product obtained by reacting an amidine with an acid were contained. [Selection figure] None |