| abstract |
An epoxy resin composition excellent in dielectric constant, fluidity and wire flow resistance is provided. A component comprising (A) an epoxy resin, (B) a curing agent comprising a phenol resin, (C) a curing accelerator, and D) an inorganic filler other than the high dielectric constant powder (E) and (D) component. Contains a resin of the following general formula (1), B component is contained in such an amount that the equivalent ratio of phenolic hydroxyl group in B component is 0.5 to 2.0 with respect to epoxy group in A component, and C component Is contained in an amount of 0.4 to 20 parts by mass per 100 parts by mass of the total amount of the A component and the B component, the D component has a higher dielectric constant than the A component, and is contained in an amount of 10 to 50 vol%. An epoxy resin composition containing 40 to 90 vol% of the total amount. (In the formula, X is a single bond or a group selected from CH 2 and C (CH 3) 2, and R 1 is a hydrogen atom, a chain or cyclic alkyl group having 1 to 6 carbon atoms, a phenyl group, and a halogen. Selected groups or atoms, which may be the same or different from each other.) [Selection figure] None |