| abstract |
Provided are a pre-applied thermosetting underfill composition having a high curing reaction rate and hardly causing curing shrinkage, an electronic component device using the same, and a method for producing the same. An imide compound having at least two structural units containing an imide structure and a carbon-carbon double bond and an organic group linking the structural unit, a (meth) acrylate compound, and a radical polymerization initiator, A pre-applied thermosetting underfill composition, an electronic component device using the same, and a method for producing the same. [Selection figure] None |