| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31663
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31504
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-265 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20 |
| filingDate |
2013-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7281fa16f84185354db0094f109193f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3af280f816f19d47c9a20fcf7ca04a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2e1943bda94327a7dee15269f7ab40c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b048780ce953657b76370c8430c2a37 |
| publicationDate |
2015-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2015026763-A |
| titleOfInvention |
Semiconductor encapsulant with sealing material, semiconductor device, and method of manufacturing semiconductor device |
| abstract |
An object of the present invention is to provide a sealing material with a base material for semiconductor sealing, which enables the manufacture of a semiconductor device having good appearance and laser marking properties, and a method for manufacturing the semiconductor device and the semiconductor device. A sealing material with a base material for semiconductor sealing for collectively sealing an element mounting surface of a semiconductor element mounting substrate on which semiconductor elements are mounted or an element forming surface of a semiconductor element forming wafer on which semiconductor elements are formed. A base material, a sealing resin layer made of an uncured or semi-cured thermosetting resin formed on one surface of the base material, and a surface resin layer formed on the other surface of the base material The sealing material with a base material for semiconductor sealing characterized by having. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017073432-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018032782-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018064054-A |
| priorityDate |
2013-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |