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filingDate 2013-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2015-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2015023231-A
titleOfInvention Semiconductor device
abstract A semiconductor device capable of at least one of improving layout flexibility and reducing noise is provided. A semiconductor device includes an adhesive layer 90 that adheres a first electrode plate 60 or a second electrode plate 100 and an insulating member 70. The insulating member 70 includes a first resin material 130 to which a dielectric filler 132 is added. The adhesive layer 90 includes a second resin material 140 to which a conductive filler 142 having an average particle size smaller than that of the dielectric filler 132 is added. The first electrode plate 60, the second electrode plate 100, the insulating member 70, and the adhesive layer 90 constitute a capacitor 110a. [Selection] Figure 7
priorityDate 2013-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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