| abstract |
A resin composition used for an insulating layer of a multilayer printed wiring board by a build-up method, which has an excellent balance of thermal expansion coefficient, glass transition temperature, plating peel strength performance, and the resin composition Provided are a prepreg, a resin sheet, a laminate, a printed wiring board, and a semiconductor device using the object. A resin composition according to the present invention includes an epoxy resin represented by the following general formula (1), a cyanate ester resin, an aromatic polyamide resin containing at least one hydroxyl group, and an inorganic filler. It becomes. [Selection] Figure 1 |