| abstract |
The present invention provides a phenolic hydroxyl group-containing compound having excellent heat resistance and flame retardancy in a cured product, a phenol resin containing the compound, a curable composition, a cured product thereof, a semiconductor sealing material, and a printed wiring board. A phenolic hydroxyl group-containing compound having a molecular structure represented by formula (1) and / or (2). And resins containing these phenolic hydroxyl group-containing compounds. [K is an integer of 1 to 3; each of the benzene ring and the naphthalene ring may contain any of a C1-4 alkyl group, a C1-4 alkoxy group, an aryl group, or an aralkyl group as a substituent] [Selection figure] None |